Features and Benefits
Very low thermal resistance
High stickiness surface, easy to use
RoHS recognized

SY-PC 300 Phase change materials provide a verylow thermal resistance for heat transfer module such as high efficiencyprocessor and heat sink. This material can change the phase at 50℃-52℃. Theproduct is a fluid sticky material but will not overflow, which can fill thegap,Wet the contact surface thoroughly and improve the heat transmission efficiency.
SY-PC 300 thermal conductive gaskethas inherent adhesive properties, covering the micro uneven surface so as tomake good contact with the components to improve the efficiency of heattransmission.